Innovative Heat Sink Materials:
Metal-Diamond composites such as aluminium-diamond, copper-diamond or silver-diamond are composite materials which allow to combine a high thermal conductivity (range from 300 to 650 W/mK) with a tailored (significantly reduced) coefficient of thermal expansion (between 6 to 12 ppm/K). These materials are of interest for applications as heat sinks, heat spreaders, heat slugs or base plates to provide a reliable and sufficient cooling. |
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Metal-Diamond plates can be produced in various size between 10mm x 10mm to 150mm x 150mm with thickness typically ranging from 2 – 20 mm. Due to the use of sandwich technology hp technology is able to provide plates with a high surface quality.
By using hot pressing technology to prepare these type of materials, it is possible to realize sandwich structures or even parts with a certain complexity. Examples for applications of this type of materials are given in several areas of micro, power- or optoelectronic devices such as: Heat spreaders or lids for CPUs in high performance computing or server applications; Cooling plates for LED or laser diodes;
Base plate for high power module (IGBT)
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Further information you find in our product-sheets in the download-area.